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 Signal and Timing Parameters I Common Clock – Class 2 Agenda Voltage and time SI Budgets What Failing SI Means: Negative margin Simple I/O Architecture Synchronous Memory Elements - Operation Synchronous Memory Elements - Timing Simple Flight Time Concept Synchronous Bus Operation Transmit Clock Sequence Data Path Sequence Receive Clock Sequence Clock Skew Sources of Clock Skew Clock Jitter Skew & Jitter Example Setup Timing Diagram & Loop Analysis Hold Timing Equation Manufacturability Considerations Revised Timing Equations Device Specs and Test Loads Impact of Spec Loads Flight Time Flight Time Explained Revised Timing Equations Example: Bus Timing Spread Sheet – Setup times Synchronous Timing Summary Assignment

Презентация на тему: «Signal and Timing Parameters I Common Clock – Class 2». Автор: Richard Mellitz. Файл: «Signal and Timing Parameters I Common Clock – Class 2.ppt». Размер zip-архива: 424 КБ.

## Signal and Timing Parameters I Common Clock – Class 2

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1

### Signal and Timing Parameters I Common Clock – Class 2

Acknowledgements: Intel Bus Boot Camp: Howard Heck

Prerequisite Reading assignment: CH8 to 9.3

2

### Agenda

Voltage and Time Budgets Computer Signaling Elements and Circuits Flight time Synchronous Bus Operation Clock Skew and Jitter Setup and Hold Manufacturing Considerations Advanced Topics

Signal Parameters & Timing Class 2

3

### Voltage and time

SI boils down to meeting voltage and time specifications True for most I/O computer interfaces Violating a time or voltage specification i.e. exceeding a limit, may cause a circuit to fail Notice the use of the word “may” rather than “will” Most limits are at least 3 sigma limits. The actual sigma limits are usually a company secret. Margin is the difference between a specification and the respective measured signal parameter. Margin is considered a quality factor for a design.

Signal Parameters & Timing Class 2

4

### SI Budgets

An SI budget is a technique used to report timing and voltage margin in terms of voltage and timing components (“buckets”) for all configurations and conditions of a particular bus design. The budget is often represented in a spread sheet.

=B2-(C2+D2+E2) … Cell formula

Signal Parameters & Timing Class 2

5

### What Failing SI Means: Negative margin

+ limit

- limit

Mean

The integral of the probability function outside these limits is the failing population Pf X volume X cost/unit = variable cost of failure Not the whole story – A bad name can cost billions in fixed costs (good will)

Probability that a parameter is a certain value

Measured parameter value

Signal Parameters & Timing Class 2

6

### Simple I/O Architecture

Pre- ’00 the most common computer I/O interface was synchronous memory transfer Intel Xeon 100 MHz bus was just about the last in this class Clock distribution is a challenge – more on this later

CPUs

clock

RAM Memory & I/O control

Signal Parameters & Timing Class 2

7

### Synchronous Memory Elements - Operation

Operation A data signal (in) that is present at the input to the flip-flop is “latched” into the flip-flop by the rising edge of the input clock signal (clk). On the next rising edge of clk, the data signal is released to the output of the flip-flop (out). This means data is clocked out of device a on one clock edge and received at device b on the next clock edge. This is also called common clocking.

Signal Parameters & Timing Class 2

8

### Synchronous Memory Elements - Timing

Timing Valid data must be present for a minimum amount of time prior to the input clock edge to guarantee successful capture of the data. This is known as setup time, Tsetup. Data must remain valid for a minimum amount of time after the input clock edge to guarantee that the proper value is captured. This is called hold time, Thold.

Signal Parameters & Timing Class 2

9

### Simple Flight Time Concept

Connection Trace

Device a

Device b

The time it takes a signal to travel from device a to device b or the delay between transmitted (a) and received (b) signals. This is not the definition that SI engineers use in a timing budget There are issues with timing budgets and device timing parameters that make this a poor definition. We will develop the exact definition of flight time for SI later SI engineers use the term propagation delay but it is not the same as AC propagation delay. We will develop the exact definition later; for now let’s consider all delays the same. AC is frequency domain analysis.

Signal Parameters & Timing Class 2

10

### Synchronous Bus Operation

Explain picture?

clk

a

b

We wish to use the clock to control the transmission of data from the latch in the source (a) to the latch in the destination (b). The initial clock pulse causes the source latch to release the data onto the interconnect. The next clock pulse causes the destination latch to capture the data that was transmitted on the interconnect We have 1 full clock cycle to get the data from the source to destination.

Signal Parameters & Timing Class 2

CLK

CLK

CORE

CORE

FROM

TO

Q

Q

D

D

11

### Transmit Clock Sequence

Initial (driving) clock pulse transmission from clock generator to source.

Tdrv_clk = delay of the clock buffer circuit connected to the source from node 1 to node 1a. Tprop_clk = delay of the interconnect between clk & a.

clk

a

b

(1)

T

(1a)

T

(1b)

Signal Parameters & Timing Class 2

drv_clk

prop_clk

CLK

CLK

CORE

CORE

FROM

TO

Q

Q

D

D

12

### Data Path Sequence

Data transmission from source to destination.

Tdrv = delay of the output buffer circuit for the data signal. Tprop = interconnect delay between source and destination. Tsetup = delay of the input buffer plus the flip-flop setup requirement.

clk

a

b

(1)

T

T

T

T

(1a)

T

(1b)

(2b)

(2a)

(2c)

Signal Parameters & Timing Class 2

prop

CLK

CLK

CORE

CORE

FROM

TO

Q

Q

D

D

drv

setup

drv_clk

prop_clk

13

### Receive Clock Sequence

Second (receiving) clock pulse transmission from clock generator to destination.

Tdrv_clk(b) = delay of the clock buffer circuit connected to b. Tprop_clk(b) = delay of the interconnect between clk & b. Ideal assumption: Tdrv_clk = Tdrv_clk(b) & Tprop_clk = Tprop_clk(b)

clk

a

b

(1)

T

T

(b)

(3a)

(1a)

T

T

(b)

(1b)

(3b)

T

(2b)

T

T

(2a)

(2c)

Signal Parameters & Timing Class 2

CLK

CLK

CORE

CORE

FROM

TO

Q

Q

D

D

drv_clk

drv_clk

prop_clk

prop_clk

prop

drv

setup

14

### Clock Skew

What happens if the clock signals at the source and destination are not in phase? What if the clock arrives at the destination before it reaches the source? Vice-versa? What are the sources of uncertainty in the phase relationship between different clock signals? Clock Skew: pin-to-pin variation in the timing of input clock at each agent (source & destination, in our example) on a bus. The net effect of clock skew is that it can reduce the total delay that signals are allowed to have for a given frequency target. require larger minimum signal delays in order to avoid logic errors. (We’ll cover this in more detail shortly.)

Signal Parameters & Timing Class 2

Transmit clock at device a

Receive clock at device b

15

### Sources of Clock Skew

Clock skew is caused by: variation between the clock driver circuits in a given part (Tdrv). variation in the loading between different agents on the bus (CL). variation in interconnect characteristics (Z0, td ). variation in electrical lengths. What is electrical length?

Signal Parameters & Timing Class 2

16

### Clock Jitter

Cycle to cycle variation of clock Changes the time available for data to get from transmitter to receiver Jitter + Skew = Clock uncertainty for setup Skew = Clock uncertainty for hold Hold uses same cycle of clock In many cases we can ignore certain types of jitter There are other types of jitter – more advanced topic

Signal Parameters & Timing Class 2

Idea clock

Clock with Cycle to Cycle Jitter

Bar graph of each cycle time

Pulse Width

Pulse Width

(Ideal)

(Actual)

17

### Skew & Jitter Example

100 MHz bus Minimum clock period = 10 ns Given: Maximum skew = 250 ps Maximum edge-edge jitter = 250 ps. Calculate the minimum effective clock period: minimum effective period = minimum period – maximum skew – maximum jitter min effective period = 10.0 ns – 0.25 ns – 0.25 ns = 9.5 ns Therefore, maximum allowed for silicon plus interconnect delay is 9.5 ns.

Signal Parameters & Timing Class 2

18

### Setup Timing Diagram & Loop Analysis

Tcycle

Signal Parameters & Timing Class 2

19

### Hold Timing Equation

Uses same clock edge Hold equation Define Clock Delay Clock Skew Simplify

Signal Parameters & Timing Class 2

20

### Manufacturability Considerations

Sources of variability in silicon: manufacturing process (e.g. silicon gate length) operating temperature (MOS speed ? as temp ?) operating voltage (MOS speed ? as voltage ?) Impact: variability leads to a range of values for driver and receiver timings Example: Pentium® Pro GTL+ timings Minimum driver valid delay = 0.55 ns Maximum driver valid delay = 4.40 ns Maximum receiver setup time = 2.20 ns Maximum receiver hold time = 0.45 ns Sources of interconnect variability: Manufacturing variation (Z0, er) Trace length variation (among 144 signals for FSB, for example)

Signal Parameters & Timing Class 2

21

### Revised Timing Equations

Setup

Product specifications must comprehend the expected variation. We need to modify the setup & hold equations: The setup equation defines the minimum clock cycle time (max frequency) in terms of the maximum system delay terms. We want Tmargin_setup ? 0. Excessive system delays can be handled by increasing cycle time, at the cost of reduced performance. The hold equation defines minimum system delay requirements to avoid logic errors due to hold violations. We want Tmargin_hold ? 0. Minimum delay violations cannot be fixed by increasing cycle time. Why?

Signal Parameters & Timing Class 2

22

### Device Specs and Test Loads

System

Device specifications vs. system conditions The manufacturer guarantees that the parts meet the values in the timing specifications when driving into the “spec load”. This is really the only way devices can be tested. The spec load is typically equal to the load presented to the device by the device level test environment. This spec load is generally not the same as the load presented to the device by the system interconnect.

W

65

10pF

Signal Parameters & Timing Class 2

23

### Impact of Spec Loads

Since the spec load is NOT equal to the load on the device when placed in a system: An output buffer will have a different delay in the system than in the test environment. To deal with this: define new timing terms change the way we break the timings into separate components.

Signal Parameters & Timing Class 2

24

### Flight Time

Tco

Voltage

Time

Tflight

Tdrv

Tprop

Threshold

Driver Pin into System Load

Clock Input to Transmitting Chip

Driver Pin into Test Load

Signal Parameters & Timing Class 2

25

### Flight Time Explained

Define Tco (time from clock-in to data-out) as the delay from the input clock to the output data when driving into the test load. Define Tflight (flight time) as the delay to the receiver minus the Tco. By defining the timings in this way, the flight time accounts for the propagation delay of the interconnect PLUS the difference between the driver delays when driving test load vs. the system load. Notice: We defined Tco and Tflight this way to guarantee the overall system timings remain the same.

Signal Parameters & Timing Class 2

26

### Revised Timing Equations

The system designer relies on the synchronous timing equations help define the working flight time window (min-to-max) with the given component timing specs. Ultimately, the equations provide a tool for a design team. Use them to evaluate design trade-offs in order to achieve system performance (frequency) targets.

Signal Parameters & Timing Class 2

27

### Example: Bus Timing Spread Sheet – Setup times

Signal Parameters & Timing Class 2

28

### Synchronous Timing Summary

Synchronous memory elements require a stable data signal for a minimum amount of time prior to (SETUP) & after (HOLD) the input clock. Hold and setup conditions determine the minimum and maximum system delays. Setup and hold conditions can be analyzed by constructing timing loops in the timing diagrams. Component delays exhibit variation across process and environmental conditions. Interconnect delays vary due to design and process. Redefining driver and interconnect delays in terms of system and “spec” loads allows manufacturers to specify and test component delays. System timing equations provide a key tool for examining trade-offs during system design.

Signal Parameters & Timing Class 2

29

### Assignment

Create Budget Spreadsheet for setup and hold Find and justify maximum frequency of operation Find all minimum lengths

CPU1

CPU4

CPU2

CPU3

L1=5”

L4=3”

L3=2”

Chipset

L2=2”

Signal Parameters & Timing Class 2

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